Exhibitions:
ILA
at Berlin, Germany:
September 11 - 13, 2012
electronica
at Munich, Germany:
November 13 - 16, 2012
Pulsonix:
new version 7.5
CAM350:
new version 10.7
BluePrint-PCB:
new version 3.2
...
Area of competence
Equipment
- Vötsch and CTS climatic exposure test cabinet
- X-Tek CPX160 x-ray system
- VISCOM AOI system
- Spea 4040 flying probe
- 2 x Dr. Eschke CT300 Meteor ICT universal test systems
- Boundary scan (Göpel)
- WEE W424 cable tester
- Erfi TSI100 high voltage tester
- Metallurgical polished specimen testing
Test procedures
- Optical procedure: testing of the assembly optically or using x-ray analysis, automatically or manually.
- Electronic processes: In-circuit test: testing of assemblies in their installed condition for operating values and correct functioning via a bed-of-nails tester or with a flying prober.
- Boundary scan test: Digital test procedure according to IEEE1149.1 for assemblies with integrated components specially designed for the procedure
- Functional testing
Test concepts with flying probe
- Short circuit test
- Connection test
- Testing of resistances, condensers and diodes
- Testing of bipolar transistors, field effect transistors and MOSFETS
- Testing of open solder joints of, for example, BGAs via measurement of protective diodes at the component
- Optionally, simple tests can be carried out, such as testing of the current consumption of an assembly
Mature testing concepts

To achieve professional customer demands, the preconditions are high precision technical equipment and highly qualified employees in the testing department. tecnotron meets these demands by means of a comprehensive test equipment inventory and expert staff.
tecnotron offers three techniques for use in the testing of assemblies in an electronics production facility:
- Structural tests
- Functional tests
- System tests
Mature test concepts as a part and parcel of the development process ensure the economic use of test equipment and high testing coverage.




